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NTLUD3A260PZ
Power MOSFET
? 20 V, ? 2.1 A, m Cool t Dual P ? Channel,
ESD, 1.6x1.6x0.55 mm UDFN Package
Features
? UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
? Low Profile UDFN 1.6x1.6x0.55 mm for Board Space Saving
? ESD Protected
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? High Side Load Switch
? PA Switch
? Optimized for Power Management Applications for Portable
Products, such as Cell Phones, PMP, DSC, GPS, and others
V (BR)DSS
? 20 V
http://onsemi.com
MOSFET
R DS(on) MAX
200 m W @ ? 4.5 V
290 m W @ ? 2.5 V
390 m W @ ? 1.8 V
650 m W @ ? 1.5 V
D1
I D MAX
? 2.1 A
D2
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter Symbol Value
Units
G1
G2
Drain-to-Source Voltage
V DSS
? 20
V
Gate-to-Source Voltage
Continuous Drain Steady
Current (Note 1) State
t ≤ 5s
Power Dissipa- Steady
tion (Note 1) State
t ≤ 5s
Continuous Drain
Steady
Current (Note 2)
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
V GS
I D
P D
I D
± 8.0
? 1.7
? 1.2
? 2.1
0.8
1.3
? 1.3
? 0.9
V
A
W
A
1
6
S1 S2
P ? Channel MOSFET
MARKING
DIAGRAM
UDFN6 1
CASE 517AT AD M G
m COOL t G
AD = Specific Device Code
M = Date Code
G = Pb ? Free Package
Power Dissipation (Note 2)
Pulsed Drain Current
T A = 25 ° C
tp = 10 m s
P D
I DM
0.5
? 8.0
W
A
(Note: Microdot may be in either location)
Operating Junction and Storage
Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J ,
T STG
I S
T L
-55 to
150
? 0.6
260
° C
A
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm 2 , 2 oz. Cu.
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2010
September, 2010 ? Rev. 1
1
Publication Order Number:
NTLUD3A260PZ/D
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